foup/fosb inspection system
xtrim-fi-300
equipment overview
support the complete localization of all components and parts；ld/uld ;robot;3d measure；ffu
3d inspection
3d multi-directional measurement，z49，z47，x46，y52，y46，r1，wafer plane height，semi standard-specified items (x30, x31, z30, z31, etc.)
automatic calibration
equipped with an automatic calibration function, which ensures the accuracy of each measurement.
high precision & consistency: accuracy up to ±25μm, repeatability of multiple inspections: ±15μm
low cost of ownership (coo)
the smallest size in the industry
field/product
substrate manufacturing, wafer manufacturing, advanced packaging/foup、fosb