automatic single wafer brushing equipment
xtrim-sc-br300
equipment overview
ld/uld、brush chamber、clean chamber、transfer module、robot、cdu
comprehensive functions
supports dual-sided brushing and edge brushing
optional basic configurations: nano-spray、mega-sonic、diw、n2
customizable
supports wafers from 6”to 12”
customizable multi-chamber configuration based on the needs
automation
supports cmp system and offline tank loading
automatic robot load/unload
automatic make up and dosing
pollution control
professionally chosen material to better control particles
modular wafer transfer between chambers in a sealed environment
superior process performance
particle: 26nm average ≤ 10ea/wafer @ee = 2
metal: 1e8 atoms/cm2