automatic backside etching equipment
xtrim-sc-bc300
xtrim-sc-be300
equipment overview
loadport*2、chamber*2、bernoulli robot、bernoulli chuck
customizable
supports wafer from 6” to 12”
supports thk: 100 - 775um
supports taiko wafer and glass wafer
automation
robotic wafer handling
automatic make up and dosing system
contactless transfer & etching process
contactless wafer transfer via bernoulli robotic arm
bernoulli chuck protects wafers from chemical splashing
superior process performance
- particle ＜ 30ea @ 0.16um
- metal: 1e8 atoms/cm2 •wiw/wtw ＜ 3%