lapping clean
xtrim-bc-h300
equipment overview
主要应用于12”硅片衬底制造研磨后清洗
dedicated lapping machine pairing
enables immediate transfer to cleaning after lapping, preventing dried grinding slurry residue
fully synchronized with lapping process cycle
superior cleaning performance
combines immersion ultrasonic cleaning, horizontal roller brush scrubbing, dual-fluid spray rinsing, and high-pressure air knife drying for rapid post-lapping wafer surface cleaning
compact footprint
space-efficient design integrating advantages of batch immersion, single-wafer processing, and horizontal brush cleaning
high automation
wet-in/dry-out operation with robotic arm automatic wafer handling; optional open cassette or foup unloading configurations